At the recent Department of Commerce (DOC) Supply Chain Summit, the Supply Chain Center introduced SCALE, a diagnostic tool designed to assess structural supply chain risk across the U.S. economy. The SCALE tool employs a comprehensive set of indicators to evaluate risks and vulnerabilities, providing a robust framework for enhancing supply chain resilience.
SCALE will offer a comparative analysis of risks across different industries, delving into the underlying factors contributing to these risks. This insight will enable the U.S. government to adopt a more proactive and strategic approach to managing supply chain risks, fostering data-driven discussions with industry stakeholders on risks, opportunities, and actions to bolster supply chain resilience.
Key Developments:
SCALE Tool Findings: The Supply Chain Center will soon release key findings from the SCALE tool, accompanied by expert insights from the Industry & Analysis (I&A) division. These findings will be shared with industry and key stakeholders to facilitate informed discussions on addressing identified risks.
SCALE Tool Data Competition: To enhance the tool’s effectiveness, I&A will launch a competition inviting new data and analyses to expand the risk indicators incorporated into SCALE.
Expanded Industry Engagement: This fall, Secretary Gina Raimondo will convene a meeting with industry leaders to discuss risks related to AI data center supply chains. This gathering aims to address both upstream and downstream challenges and provide recommendations for mitigating risks.
Industry Supply Chain Tabletop Exercises: In 2025, I&A will conduct two tabletop exercises focused on supply chain risks in the chemicals industry and emerging technologies critical for maintaining U.S. strategic advantage.
New Strategic Partnerships: Seven new strategic partnerships were announced at the Summit with organizations including Carnegie Mellon University and Georgetown University. These collaborations aim to enhance U.S. industry competitiveness, resilience, and innovation.
